BGA-4 Breakout Board (1.04 x 1.07 mm, 0.5 mm)

IC Breakout, LLC

SKU: ICB00130

This is a breakout board that was designed to be a DIP adapter for the BGA-4 type SMD packages. This board will require a re-flow oven or hot air gun to solder the part on the board.

Technical Details

Footprint Dimensions

Body (mm):

1.04 x 1.07

Pitch (mm):


Thermal Pad (mm):


Breakout Board Dimensions

Board Dimensions (mil):

450 x 370

Board Thickness (mil):


Through-Hole Spacing (mil):

300 mil (X-axis)

100 mil (Y-axis)

Breakout Board Specifications

Board Layers:



Immersion Gold


1 oz

Traces (mil)


Trace Lengths (mil):


Pin/Through-Hole Count:


What's Included?

Parts Installed on Board:


Parts Included (but not installed):

4 PIN Break Away Header (Straight)

Additional Features

    • Easily identifiable PIN 1 indicator and PIN numbers
    • White silk “Label Pads” allow you to label the pins for quick reference
    • Extended through-hole pads make for an easy connection point for surface mount parts
    • Breadboard friendly pin spacing
    • All boards have been E-tested for failures and are RoHS compliant
…More details on our additional features can be found HERE


Datasheet (PDF)

Dimension Document (PDF) 

(includes a 1:1 Scale Image of the board to ensure that it will be a good fit for your project!)

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