
ICB80001
$3.95 USD
In StockThis is a breakout board that was designed to be a DIP adapter specifically for InvenSense parts, INMP401 or ADMP401.
Footprint Dimensions |
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Body (mm): |
4 x 5 |
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Pitch (mm): |
1.20 |
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Thermal Pad (mm): |
n/a |
Breakout Board Dimensions |
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Board Dimensions (mil): |
320 x 440 |
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Board Thickness (mil): |
62 |
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Through-Hole Spacing (mil): |
100 mil (X-axis) |
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n/a (Y-axis) |
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Breakout Board Specifications |
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Board Layers: |
2 |
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Finish: |
Immersion Gold |
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Copper: |
1 oz |
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Traces (mil) |
30 |
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Trace Lengths (mil): |
<50 |
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Pin/Through-Hole Count: |
3 |
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Parts Installed on Board: |
None |
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Parts Included (but not installed): |
3 PIN Break Away Header (Straight) |
Manufacturing Support
Whether you need low-volume prototyping or full-turnkey scaling for components like the MEMS Microphone Breakout Board (INMP401), IC Breakout provides reliable Contract Electronics Manufacturing out of our Reno, NV facility. Stop worrying about component sourcing and factory defects.