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SON-8 Breakout Board (3 x 2 mm, 0.5 mm)

ICB00160

SON-8 Breakout Board (3 x 2 mm, 0.5 mm)

$2.95 USD

In Stock

Technical Overview

This is a breakout board that was designed to be a DIP adapter for the SON-8 type SMD packages. Some of the SON types that can be used with this board include: VSON, WSON, XSON, HVSON, HWSON, HXSON.

Technical Details

Footprint Dimensions

Body (mm):

3 x 2

Pitch (mm):

0.5

Thermal Pad (mm):

n/a

Breakout Board Dimensions

Board Dimensions (mil):

450 x 370

Board Thickness (mil):

62

Through-Hole Spacing (mil):

300 mil (X-axis)

100 mil (Y-axis)
Breakout Board Specifications

Board Layers:

2

Finish:

Immersion Gold

Copper:

1 oz

Traces (mil)

10

Trace Lengths (mil):

<200

Pin/Through-Hole Count:

8

What's Included?

Parts Installed on Board:

None

Parts Included

(but not installed):

8 PIN Break Away Header (Straight)

Additional Features

    • Easily identifiable PIN 1 indicator and PIN numbers
    • White silk “Label Pads” allow you to label the pins for quick reference
    • Extended through-hole pads make for an easy connection point for surface mount parts
    • Breadboard friendly pin spacing
    • All boards have been E-tested for failures and are RoHS compliant
…More details on our additional features can be found HERE

Documentation

(includes a 1:1 Scale Image of the board to ensure that it will be a good fit for your project!)

Manufacturing Support

Need Custom Manufacturing for SON-8 Breakout Board (3 x 2 mm, 0.5 mm)?

Whether you need low-volume prototyping or full-turnkey scaling for components like the SON-8 Breakout Board (3 x 2 mm, 0.5 mm), IC Breakout provides reliable Contract Electronics Manufacturing out of our Reno, NV facility. Stop worrying about component sourcing and factory defects.

Reno Electronics ManufacturingUSA PCB Assembly